(module D8 (layer F.Cu) (tedit 5703C7D4)
  (descr "8-Lead Plastic Small Outline (SN) - Narrow, 3.90 mm Body [SOIC] (see Microchip Packaging Specification 00000049BS.pdf)")
  (tags "SOIC 1.27 D8")
  (solder_mask_margin 0.05)
  (attr smd)
  (fp_text reference REF** (at 0 -4.2) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value D8 (at -0.1 -0.5) (layer F.Fab) hide
    (effects (font (size 0.4 0.4) (thickness 0.1)))
  )
  (fp_line (start -2.9 2.2) (end -2.9 1.7) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.6 1.4) (end -1.9 2) (layer F.Fab) (width 0.15))
  (fp_line (start -2.2 1.4) (end -1.6 1.4) (layer F.Fab) (width 0.15))
  (fp_line (start -1.9 2) (end -2.2 1.4) (layer F.Fab) (width 0.15))
  (fp_line (start -2.9 3.5) (end 2.9 3.5) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.9 3.5) (end 2.9 -3.5) (layer F.CrtYd) (width 0.05))
  (fp_line (start 2.4 2.2) (end 2.9 2.2) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.4 -2.2) (end 2.9 -2.2) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.9 2.2) (end -2.4 2.2) (layer F.SilkS) (width 0.15))
  (fp_line (start -2.9 -2.2) (end -2.4 -2.2) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.9 2.2) (end 2.9 -2.2) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.5 -2) (end 2.5 2) (layer F.Fab) (width 0.15))
  (fp_line (start -2.5 -2) (end -2.5 2) (layer F.Fab) (width 0.15))
  (fp_line (start -2.5 2) (end 2.5 2) (layer F.Fab) (width 0.15))
  (fp_line (start -2.5 -2) (end 2.5 -2) (layer F.Fab) (width 0.15))
  (fp_text user %R (at 0.1 0.4) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.1)))
  )
  (fp_line (start -2.9 -3.5) (end 2.9 -3.5) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.9 3.5) (end -2.9 -3.5) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.9 0.8) (end -2.9 -2.2) (layer F.SilkS) (width 0.15))
  (pad 1 smd rect (at -1.905 2.7 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -0.635 2.7 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at 0.635 2.7 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at 1.905 2.7 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at 1.905 -2.7 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 0.635 -2.7 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -0.635 -2.7 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
  (pad 8 smd rect (at -1.905 -2.7 90) (size 1.55 0.6) (layers F.Cu F.Paste F.Mask))
  (model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
