(module DDA (layer F.Cu) (tedit 5718D218)
  (descr "Texas Instruments DDA")
  (tags "SOIC 8 powerpad")
  (solder_mask_margin 0.05)
  (attr smd)
  (fp_text reference REF** (at -3.967201 0.194883 90) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value DDA (at 0 -0.1) (layer F.Fab) hide
    (effects (font (size 0.4 0.3) (thickness 0.075)))
  )
  (fp_circle (center 1.5 1) (end 1.5 1.25) (layer F.Mask) (width 0.05))
  (fp_line (start -1.5 1) (end -1.5 -1) (layer F.Fab) (width 0.05))
  (fp_line (start 1.5 1) (end -1.5 1) (layer F.Fab) (width 0.05))
  (fp_line (start 1.5 -1) (end 1.5 1) (layer F.Fab) (width 0.05))
  (fp_line (start -1.5 -1) (end 1.5 -1) (layer F.Fab) (width 0.05))
  (fp_text user 1 (at -2.9 2.9) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text user %R (at -3.967201 0.194883 90) (layer F.Fab)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_line (start -1.717201 2.194883) (end -1.967201 2.694883) (layer F.Fab) (width 0.05))
  (fp_line (start -2.217201 2.194883) (end -1.717201 2.194883) (layer F.Fab) (width 0.05))
  (fp_line (start -1.967201 2.694883) (end -2.217201 2.194883) (layer F.Fab) (width 0.05))
  (fp_line (start 2.5 -2) (end -2.5 -2) (layer F.Fab) (width 0.15))
  (fp_line (start 2.5 2) (end 2.5 -2) (layer F.Fab) (width 0.15))
  (fp_line (start -2.5 2) (end 2.5 2) (layer F.Fab) (width 0.15))
  (fp_line (start -2.5 -2) (end -2.5 2) (layer F.Fab) (width 0.15))
  (fp_line (start -2.967201 3.194883) (end 3.032799 3.194883) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.967201 -2.805117) (end 3.032799 -2.805117) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.967201 3.194883) (end -2.967201 -2.805117) (layer F.CrtYd) (width 0.05))
  (fp_line (start 3.032799 3.194883) (end 3.032799 -2.805117) (layer F.CrtYd) (width 0.05))
  (fp_line (start -2.967201 -2.805117) (end -2.367201 -2.805117) (layer F.SilkS) (width 0.15))
  (fp_line (start 2.432799 -2.805117) (end 3.032799 -2.805117) (layer F.SilkS) (width 0.15))
  (fp_line (start 3.032799 3.194883) (end 2.432799 3.194883) (layer F.SilkS) (width 0.15))
  (fp_line (start -3 2) (end -2.967201 -2.805117) (layer F.SilkS) (width 0.15))
  (fp_line (start 3.032799 3.194883) (end 3.032799 -2.805117) (layer F.SilkS) (width 0.15))
  (pad 8 smd rect (at -1.905 -2.875) (size 0.5 2.2) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -0.635 -2.875) (size 0.5 2.2) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 0.635 -2.875) (size 0.5 2.2) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at 1.905 -2.875) (size 0.5 2.2) (layers F.Cu F.Paste F.Mask))
  (pad 1 smd rect (at -1.905 2.875) (size 0.5 2.2) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -0.635 2.875) (size 0.5 2.2) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at 0.635 2.875) (size 0.5 2.2) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at 1.905 2.875) (size 0.5 2.2) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 0 0) (size 3.7 2.95) (layers F.Cu F.Paste F.Mask)
    (solder_mask_margin -0.275))
  (pad 9 thru_hole circle (at -1.3 0.65) (size 0.4 0.4) (drill 0.33) (layers *.Cu F.Mask)
    (solder_mask_margin 0.00001))
  (pad 9 thru_hole circle (at 1.3 0.65) (size 0.4 0.4) (drill 0.33) (layers *.Cu F.Mask)
    (solder_mask_margin 0.0001))
  (pad 9 thru_hole circle (at 0 0.65) (size 0.4 0.4) (drill 0.33) (layers *.Cu F.Mask)
    (solder_mask_margin 0.00001))
  (pad 9 thru_hole circle (at -1.3 -0.65) (size 0.4 0.4) (drill 0.33) (layers *.Cu F.Mask)
    (solder_mask_margin 0.0001))
  (pad 9 thru_hole circle (at 0 -0.65) (size 0.4 0.4) (drill 0.33) (layers *.Cu F.Mask)
    (solder_mask_margin 0.00001))
  (pad 9 thru_hole circle (at 1.3 -0.65) (size 0.4 0.4) (drill 0.33) (layers *.Cu F.Mask)
    (solder_mask_margin 0.0001))
)