(module DGN (layer F.Cu) (tedit 57067913)
  (descr "Texas Instruments Package DGN")
  (tags "SO8 0.65mm + EP")
  (solder_mask_margin 0.07)
  (attr smd)
  (fp_text reference REF** (at 0 -4) (layer F.SilkS)
    (effects (font (size 1 1) (thickness 0.15)))
  )
  (fp_text value DGN (at 0 0.25) (layer F.Fab) hide
    (effects (font (size 0.4 0.4) (thickness 0.1)))
  )
  (fp_circle (center -1 1.1) (end -0.8 1.1) (layer F.Fab) (width 0.15))
  (fp_line (start -1.8 2.3) (end -1.8 2.1) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.8 2.3) (end -1.6 2.3) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.6 2.3) (end -1.6 2.1) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.8 2.1) (end -1.6 2.1) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.75 3) (end 1.75 3) (layer F.CrtYd) (width 0.05))
  (fp_line (start 1.75 3) (end 1.75 -3) (layer F.CrtYd) (width 0.05))
  (fp_line (start 1.5 1.75) (end 1.75 1.75) (layer F.SilkS) (width 0.15))
  (fp_line (start 1.5 -1.75) (end 1.75 -1.75) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.75 1.75) (end -1.5 1.75) (layer F.SilkS) (width 0.15))
  (fp_line (start -1.75 -1.75) (end -1.5 -1.75) (layer F.SilkS) (width 0.15))
  (fp_line (start 1.75 1.75) (end 1.75 -1.75) (layer F.SilkS) (width 0.15))
  (fp_line (start 1.5 -1.5) (end 1.5 1.5) (layer F.Fab) (width 0.15))
  (fp_line (start -1.5 -1.5) (end -1.5 1.5) (layer F.Fab) (width 0.15))
  (fp_line (start -1.5 1.5) (end 1.5 1.5) (layer F.Fab) (width 0.15))
  (fp_line (start -1.5 -1.5) (end 1.5 -1.5) (layer F.Fab) (width 0.15))
  (fp_text user %R (at 0.25 -0.5) (layer F.Fab)
    (effects (font (size 0.6 0.6) (thickness 0.1)))
  )
  (fp_line (start -1.75 -3) (end 1.75 -3) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.75 3) (end -1.75 -3) (layer F.CrtYd) (width 0.05))
  (fp_line (start -1.75 1.75) (end -1.75 -1.75) (layer F.SilkS) (width 0.15))
  (pad 8 smd rect (at -0.975 -2.1) (size 0.4 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 7 smd rect (at -0.325 -2.1) (size 0.4 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 6 smd rect (at 0.325 -2.1) (size 0.4 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 5 smd rect (at 0.975 -2.1) (size 0.4 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 1 smd rect (at -0.975 2.1) (size 0.4 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 2 smd rect (at -0.325 2.1) (size 0.4 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 3 smd rect (at 0.325 2.1) (size 0.4 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 4 smd rect (at 0.975 2.1) (size 0.4 1.6) (layers F.Cu F.Paste F.Mask))
  (pad 9 smd rect (at 0 0) (size 1.89 1.57) (layers F.Cu F.Paste F.Mask))
  (pad 9 thru_hole circle (at 0 0) (size 0.4 0.4) (drill 0.2) (layers *.Cu))
  (pad 9 thru_hole circle (at 0.6 -0.45) (size 0.4 0.4) (drill 0.2) (layers *.Cu))
  (pad 9 thru_hole circle (at 0.6 0.45) (size 0.4 0.4) (drill 0.2) (layers *.Cu))
  (pad 9 thru_hole circle (at -0.6 0.45) (size 0.4 0.4) (drill 0.2) (layers *.Cu))
  (pad 9 thru_hole circle (at -0.6 -0.45) (size 0.4 0.4) (drill 0.2) (layers *.Cu))
  (model Housings_SOIC.3dshapes/SOIC-8_3.9x4.9mm_Pitch1.27mm.wrl
    (at (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)