(kicad_pcb (version 20230620) (generator pcbnew)
  (general
    (thickness 0.8)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (1 "In1.Cu" signal)
    (2 "In2.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "prepreg") (thickness 0.1) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "In1.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 2" (type "core") (thickness 0.44) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "In2.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 3" (type "prepreg") (thickness 0.1) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x00310fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions true)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 6)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (pdf_front_fp_property_popups true)
      (pdf_back_fp_property_popups true)
      (dxfpolygonmode true)
      (dxfimperialunits false)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue false)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk true)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "production")
    )
  )
  (property "PROJECT_ID" "726")
  (property "PROJECT_NAME" "sbm-swappable-battery-module")
  (property "PROJECT_NUMBER" "1743")
  (property "PROJECT_VERSION" "V1.0.0")
  (net 0 "")
  (net 1 "A")
  (net 2 "B")
  (footprint "lib:SolderWirePad_1x01_SMD_2.9x7.8mm" (layer "F.Cu")
    (at 43.415695 32.455979)
    (descr "Wire Pad, Square, SMD Pad,  2.9mm x 7.8mm,")
    (tags "MesurementPoint Square SMDPad 2.9mmx7.8mm ")
    (property "Reference" "J2" (at 0 -5 0) (layer "F.SilkS") hide)
    (property "Value" "CELL2" (at 0 2.54 0) (layer "F.Fab"))
    (property "Footprint" "" (at 0 0 0 unlocked) (layer "F.Fab") hide)
    (property "Datasheet" "" (at 0 0 0 unlocked) (layer "F.Fab") hide)
    (property "Description" "Generic connector, single row, 01x01, script generated (kicad-library-utils/schlib/autogen/connector/)" (at 0 0 0 unlocked) (layer "F.Fab") hide)
    (sheetfile "prj.kicad_sch")
    (clearance 1)
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text user "${REFERENCE}" (at 0 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at 0 0) (size 2.6 7.5) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.1)
      (net 2 "B") (pinfunction "Pin_1") (pintype "passive")
    )
  )
  (footprint "lib:SolderWirePad_1x01_SMD_2.9x7.8mm" (layer "F.Cu")
    (at 36.750695 25.759979 -90)
    (descr "Wire Pad, Square, SMD Pad,  2.9mm x 7.8mm,")
    (tags "MesurementPoint Square SMDPad 2.9mmx7.8mm ")
    (property "Reference" "J1" (at 0 -5 90) (layer "F.SilkS") hide)
    (property "Value" "CELL3" (at 0 2.54 90) (layer "F.Fab"))
    (property "Footprint" "" (at 0 0 -90 unlocked) (layer "F.Fab") hide)
    (property "Datasheet" "" (at 0 0 -90 unlocked) (layer "F.Fab") hide)
    (property "Description" "Generic connector, single row, 01x01, script generated (kicad-library-utils/schlib/autogen/connector/)" (at 0 0 -90 unlocked) (layer "F.Fab") hide)
    (property "exclude_from_bom" "" (at 0 0 0) (layer "F.Fab") hide)
    (sheetfile "prj.kicad_sch")
    (clearance 1)
    (attr exclude_from_pos_files exclude_from_bom)
    (pad "1" smd roundrect (at 0 0 270) (size 2.6 7.5) (layers "F.Cu" "F.Mask") (roundrect_rratio 0.1)
      (net 1 "A") (pinfunction "Pin_1") (pintype "passive")
    )
  )
  (gr_rect (start 30.638641 20.033393) (end 47.301417 38.344136)
    (fill none) (layer "Edge.Cuts"))
  (zone (net 1) (net_name "A") (layer "F.Cu") (hatch edge 0.5)
    (priority 1)
    (connect_pads yes (clearance 0.127))
    (min_thickness 0.127) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.5) (thermal_bridge_width 0.5) (smoothing fillet) (radius 0.127))
    (polygon
      (pts
        (xy 32.425429 21.365684)
        (xy 32.287681 28.387628)
        (xy 42.897681 28.367628)
        (xy 43.035429 21.345684)
      )
    )
  )
)
