(kicad_pcb (version 20221018) (generator pcbnew)
  (general
    (thickness 1.599991)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" mixed)
    (31 "B.Cu" mixed)
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen") (color "White"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (color "Green") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.509991) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (color "Green") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen") (color "White"))
      (copper_finish "HAL lead-free")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (pad_to_paste_clearance -0.0762)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 6)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 1)
      (scaleselection 1)
      (outputdirectory "")
    )
  )
  (net 0 "")
  (net 1 "GND")
  (net 2 "+3V3")
  (net 3 "Net-(P2-P2)")
  (net 4 "Net-(P2-P5)")
  (footprint "Resistor_SMD:R_0805_2012Metric" (layer "F.Cu")
    (at 121.98858 74.05878 180)
    (descr "Resistor SMD 0805 (2012 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 72, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator")
    (tags "resistor")
    (property "S1MN" "")
    (property "S1PL" "")
    (property "S1PN" "")
    (property "S2MN" "")
    (property "S2PL" "")
    (property "S2PN" "")
    (property "Sheetfile" "interconnect_drc.kicad_sch")
    (property "Sheetname" "")
    (property "comment" "")
    (property "desc" "")
    (property "ki_description" "Resistor, small symbol")
    (property "ki_keywords" "R resistor")
    (property "manf" "")
    (property "manf#" "")
    (property "variant" "")
    (attr smd)
    (fp_text reference "R3" (at 0 -1.65) (layer "F.SilkS"))
    (fp_text value "R_Small" (at 0 1.65) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab"))
    (pad "1" smd roundrect (at -0.9125 0 180) (size 1.025 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.243902)
      (net 1 "GND") (pintype "passive"))
    (pad "2" smd roundrect (at 0.9125 0 180) (size 1.025 1.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.243902)
      (net 2 "+3V3") (pintype "passive"))
    (model "${KICAD6_3DMODEL_DIR}/Resistor_SMD.3dshapes/R_0805_2012Metric.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (footprint "Project:TC2030-MCP-FP" (layer "F.Cu")
    (at 130 70)
    (descr "http://www.tag-connect.com/Materials/TC2030-MCP%20PCB%20Footprint.pdf")
    (tags "TC2030-MCP PLUG-OF-NAILS(TM) CABLE")
    (property "S1MN" "")
    (property "S1PL" "")
    (property "S1PN" "")
    (property "S2MN" "")
    (property "S2PL" "")
    (property "S2PN" "")
    (property "Sheetfile" "interconnect_drc.kicad_sch")
    (property "Sheetname" "")
    (property "comment" "")
    (property "desc" "Virtual component - Tag Connect programming interface")
    (property "exclude_from_bom" "")
    (property "manf" "")
    (property "manf#" "")
    (property "variant" "")
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "P2" (at -3.98 -0.02 90) (layer "F.SilkS"))
    (fp_text value "TC2030-RS232" (at -0.35 -0.6) (layer "F.Fab"))
    (fp_text user "${REFERENCE}" (at 0.12 0.54) (layer "F.Fab"))
    (pad "" np_thru_hole circle (at -2.54 -2.54) (size 2.3749 2.3749) (drill 2.3749) (layers "*.Cu" "*.Mask" "F.SilkS"))
    (pad "" np_thru_hole circle (at -2.54 0) (size 0.991 0.991) (drill 0.9906) (layers "*.Cu" "*.Mask" "F.SilkS"))
    (pad "" np_thru_hole circle (at -2.54 2.54) (size 2.3749 2.3749) (drill 2.3749) (layers "*.Cu" "*.Mask" "F.SilkS"))
    (pad "" np_thru_hole circle (at 0.635 -2.54) (size 2.3749 2.3749) (drill 2.3749) (layers "*.Cu" "*.Mask" "F.SilkS"))
    (pad "" np_thru_hole circle (at 0.635 2.54) (size 2.3749 2.3749) (drill 2.3749) (layers "*.Cu" "*.Mask" "F.SilkS"))
    (pad "" np_thru_hole circle (at 2.54 -1.016) (size 0.991 0.991) (drill 0.991) (layers "*.Cu" "*.Mask" "F.SilkS"))
    (pad "" np_thru_hole circle (at 2.54 1.016) (size 0.991 0.991) (drill 0.991) (layers "*.Cu" "*.Mask" "F.SilkS"))
    (pad "1" connect circle (at -1.27 0.635) (size 0.787 0.787) (layers "F.Cu" "F.Mask")
      (net 2 "+3V3") (pinfunction "P1") (pintype "passive") (clearance 0.4826))
    (pad "2" connect circle (at -1.27 -0.635) (size 0.787 0.787) (layers "F.Cu" "F.Mask")
      (net 3 "Net-(P2-P2)") (pinfunction "P2") (pintype "passive") (clearance 0.4826))
    (pad "3" connect circle (at 0 0.635) (size 0.787 0.787) (layers "F.Cu" "F.Mask")
      (net 1 "GND") (pinfunction "P3") (pintype "passive") (clearance 0.4191))
    (pad "4" connect circle (at 0 -0.635) (size 0.787 0.787) (layers "F.Cu" "F.Mask")
      (net 3 "Net-(P2-P2)") (pinfunction "P4") (pintype "passive") (clearance 0.4191))
    (pad "5" connect circle (at 1.27 0.635) (size 0.787 0.787) (layers "F.Cu" "F.Mask")
      (net 4 "Net-(P2-P5)") (pinfunction "P5") (pintype "passive") (clearance 0.4191))
    (pad "6" connect circle (at 1.27 -0.635 90) (size 0.787 0.787) (layers "F.Cu" "F.Mask")
      (net 4 "Net-(P2-P5)") (pinfunction "P6") (pintype "passive") (clearance 0.4191))
  )
  (gr_rect (start 87.06 51.69) (end 177.72 112.23)
    (fill none) (layer "Edge.Cuts"))
  (zone (net 2) (net_name "+3V3") (layer "F.Cu") (name "3V3") (hatch edge 0.5)
    (connect_pads (clearance 0.2))
    (min_thickness 0.250001) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.5) (thermal_bridge_width 0.5) (smoothing chamfer))
    (polygon
      (pts
        (xy 116.84 60.96)
        (xy 134.62 60.96)
        (xy 134.62 78.74)
        (xy 116.84 78.74)
      )
    )
  )
)
