(kicad_pcb (version 20221018) (generator pcbnew)
  (general
    (thickness 1.55)
  )
  (paper "A4")
  (layers
    (0 "F.Cu" signal)
    (1 "In1.Cu" power)
    (2 "In2.Cu" power)
    (3 "In3.Cu" signal)
    (4 "In4.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user)
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "prepreg") (thickness 0.264) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "In1.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 2" (type "prepreg") (thickness 0.264) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "In2.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 3" (type "core") (thickness 0.264) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "In3.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 4" (type "prepreg") (thickness 0.264) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "In4.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 5" (type "core") (thickness 0.264) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "HAL lead-free")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (pcbplotparams
      (layerselection 0x0030000_7fffffe0)
      (plot_on_all_layers_selection 0x0001000_00000000)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 6)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits false)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue false)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 3)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "CAM/")
    )
  )
  (net 0 "")
  (net 1 "GND")
  (net 2 "+3V3")
  (net 3 "D1G")
  (net 4 "D1R")
  (net 5 "D1B")
  (net 6 "D2G")
  (net 7 "D2R")
  (net 8 "D2B")
  (net 9 "AUTO_UP")
  (net 10 "AUTO_DN")
  (net 11 "SCL")
  (net 12 "SDA")
  (net 13 "unconnected-(U2-~{INT}-Pad1)")
  (net 14 "unconnected-(U2-NC-Pad3)")
  (net 15 "unconnected-(U2-NC-Pad8)")
  (net 16 "unconnected-(U2-NC-Pad13)")
  (net 17 "unconnected-(U2-NC-Pad18)")
  (footprint "Library:SSOP20" (layer "F.Cu")
    (at -9.2 -32 -90)
    (property "Sheetfile" "mcu_2_6.kicad_sch")
    (property "Sheetname" "")
    (property "ki_description" "8 Bit Port/Expander to I2C Bus, SSOP-20")
    (property "ki_keywords" "I2C Expander")
    (attr smd)
    (fp_text reference "U2" (at -3 4.3 90) (layer "F.SilkS") hide)
    (fp_text value "PCF8574ATS" (at 0 1.27 90) (layer "F.Fab") hide)
    (pad "1" smd roundrect (at -2.925 -3.025 270) (size 1.35 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.166667)
      (net 13 "unconnected-(U2-~{INT}-Pad1)") (pinfunction "~{INT}") (pintype "open_collector+no_connect") (clearance 0.2))
    (pad "2" smd roundrect (at -2.925 -2.275 270) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 11 "SCL") (pinfunction "SCL") (pintype "input") (clearance 0.2))
    (pad "3" smd roundrect (at -2.925 -1.625 270) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 14 "unconnected-(U2-NC-Pad3)") (pinfunction "NC") (pintype "no_connect") (clearance 0.2))
    (pad "4" smd roundrect (at -2.925 -0.975 270) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 12 "SDA") (pinfunction "SDA") (pintype "bidirectional") (clearance 0.2))
    (pad "5" smd roundrect (at -2.925 -0.325 270) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 2 "+3V3") (pinfunction "VDD") (pintype "power_in") (clearance 0.2))
    (pad "6" smd roundrect (at -2.925 0.325 270) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "A0") (pintype "input") (clearance 0.2))
    (pad "7" smd roundrect (at -2.925 0.975 270) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "A1") (pintype "input") (clearance 0.2))
    (pad "8" smd roundrect (at -2.925 1.625 270) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 15 "unconnected-(U2-NC-Pad8)") (pinfunction "NC") (pintype "no_connect") (clearance 0.2))
    (pad "9" smd roundrect (at -2.925 2.275 270) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "A2") (pintype "input") (clearance 0.2))
    (pad "10" smd roundrect (at -2.925 3.025 270) (size 1.35 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.166667)
      (net 9 "AUTO_UP") (pinfunction "P0") (pintype "bidirectional") (clearance 0.2))
    (pad "11" smd roundrect (at 2.925 3.025 270) (size 1.35 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.166667)
      (net 10 "AUTO_DN") (pinfunction "P1") (pintype "bidirectional") (clearance 0.2))
    (pad "12" smd roundrect (at 2.925 2.275 270) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 3 "D1G") (pinfunction "P2") (pintype "bidirectional") (clearance 0.2))
    (pad "13" smd roundrect (at 2.925 1.625 270) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 16 "unconnected-(U2-NC-Pad13)") (pinfunction "NC") (pintype "no_connect") (clearance 0.2))
    (pad "14" smd roundrect (at 2.925 0.975 270) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 4 "D1R") (pinfunction "P3") (pintype "bidirectional") (clearance 0.2))
    (pad "15" smd roundrect (at 2.925 0.325 270) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 1 "GND") (pinfunction "VSS") (pintype "power_in") (clearance 0.2))
    (pad "16" smd roundrect (at 2.925 -0.325 270) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 5 "D1B") (pinfunction "P4") (pintype "bidirectional") (clearance 0.2))
    (pad "17" smd roundrect (at 2.925 -0.975 270) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 6 "D2G") (pinfunction "P5") (pintype "bidirectional") (clearance 0.2))
    (pad "18" smd roundrect (at 2.925 -1.625 270) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 17 "unconnected-(U2-NC-Pad18)") (pinfunction "NC") (pintype "no_connect") (clearance 0.2))
    (pad "19" smd roundrect (at 2.925 -2.275 270) (size 1.35 0.4) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.25)
      (net 7 "D2R") (pinfunction "P6") (pintype "bidirectional") (clearance 0.2))
    (pad "20" smd roundrect (at 2.925 -3.025 270) (size 1.35 0.6) (layers "F.Cu" "F.Paste" "F.Mask") (roundrect_rratio 0.166667)
      (net 8 "D2B") (pinfunction "P7") (pintype "bidirectional") (clearance 0.2))
    (model "${KIPRJMOD}/3D-models/SSOP20.step"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_rect (start -15.24 -38.9636) (end -3.2512 -26.6192)
    (fill none) (layer "Edge.Cuts"))
  (zone (net 1) (net_name "GND") (layer "F.Cu") (name "GND") (hatch edge 0.508)
    (connect_pads (clearance 0.25))
    (min_thickness 0.200001) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.25) (thermal_bridge_width 0.3) (island_removal_mode 1) (island_area_min 5))
    (polygon
      (pts
        (xy 50.2 149.7)
        (xy -50.1 149.6)
        (xy -50 -40)
        (xy 50 -40)
      )
    )
  )
)
