(kicad_pcb (version 20221018) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A5")
  (title_block
    (title "Board Drawing")
    (comment 1 "${ProjectNumber}")
    (comment 2 "${ProjectTitle}")
    (comment 3 "${ProjectAuthor}")
    (comment 4 "${ProjectVariant}")
    (comment 5 "${ProjectDate}")
  )
  (layers
    (0 "F.Cu" signal)
    (1 "In1.Cu" signal)
    (2 "In2.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
    (50 "User.1" user "Test.Points")
    (51 "User.2" user)
    (52 "User.3" user)
    (53 "User.4" user)
    (54 "User.5" user)
    (55 "User.6" user)
    (56 "User.7" user)
    (57 "User.8" user)
    (58 "User.9" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 0.48) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "In1.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 2" (type "prepreg") (thickness 0.48) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "In2.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 3" (type "core") (thickness 0.48) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "ENIG")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (aux_axis_origin 80 70)
    (grid_origin 80 70)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (plot_on_all_layers_selection 0x0000000_00000000)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (dashed_line_dash_ratio 12.000000)
      (dashed_line_gap_ratio 3.000000)
      (svgprecision 4)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin true)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue false)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk true)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "Fabrication/Gerber/")
    )
  )
  (property "ProjectAuthor" "René Široký")
  (property "ProjectDate" "01. 01. 2023")
  (property "ProjectNumber" "HTxxx.01")
  (property "ProjectTitle" "Template Project")
  (property "ProjectVariant" "Default")
  (net 0 "")
  (footprint "_PCB_Graphics:LOGO_HDK_Cu_unmask" (layer "F.Cu")
    (at 95 64)
    (property "Sheetfile" "Test_project2.kicad_sch")
    (property "Sheetname" "")
    (property "exclude_from_bom" "")
    (property "ki_description" "Logo HDK")
    (property "ki_keywords" "Logo")
    (zone_connect 0)
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "Logo1" (at -0.1 0.15) (layer "F.SilkS") hide)
    (fp_text value "HDK" (at 0.65 0.15) (layer "F.SilkS") hide)
    (zone (net 0) (net_name "") (layer "F.Cu") (name "LogoKeep") (hatch none 0.508)
      (connect_pads (clearance 0))
      (min_thickness 0.254) (filled_areas_thickness no)
      (keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed) (copperpour not_allowed) (footprints not_allowed))
      (fill (thermal_gap 0.508) (thermal_bridge_width 0.508) (island_removal_mode 2) (island_area_min 10))
      (polygon
        (pts
          (xy 99.05 66.38)
          (xy 90.95 66.38)
          (xy 90.95 61.62)
          (xy 99.05 61.62)
        )
      )
    )
  )
  (footprint "_PCB_Graphics:LOGO_HDK_Cu_unmask" (layer "B.Cu")
    (at 110 64 180)
    (property "Sheetfile" "Test_project2.kicad_sch")
    (property "Sheetname" "")
    (property "exclude_from_bom" "")
    (property "ki_description" "Logo HDK")
    (property "ki_keywords" "Logo")
    (zone_connect 0)
    (attr exclude_from_pos_files exclude_from_bom)
    (fp_text reference "Logo2" (at -0.1 -0.15) (layer "B.SilkS") hide)
    (fp_text value "HDK" (at 0.65 -0.15) (layer "B.SilkS") hide)
    (zone (net 0) (net_name "") (layer "B.Cu") (name "LogoKeep") (hatch none 0.508)
      (connect_pads (clearance 0))
      (min_thickness 0.254) (filled_areas_thickness no)
      (keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed) (copperpour not_allowed) (footprints not_allowed))
      (fill (thermal_gap 0.508) (thermal_bridge_width 0.508) (island_removal_mode 2) (island_area_min 10))
      (polygon
        (pts
          (xy 105.95 66.38)
          (xy 114.05 66.38)
          (xy 114.05 61.62)
          (xy 105.95 61.62)
        )
      )
    )
  )
  (gr_line (start 123 70) (end 80 70)
    (layer "Edge.Cuts"))
  (gr_line (start 80 70) (end 80 55)
    (layer "Edge.Cuts"))
  (gr_line (start 80 55) (end 123 55)
    (layer "Edge.Cuts"))
  (gr_line (start 123 55) (end 123 70)
    (layer "Edge.Cuts"))
  (gr_text "TOP" (at 85 69.5) (layer "F.Cu"))
  (gr_text "1" (at 81.5 76.4) (layer "F.Cu"))
  (gr_text "2" (at 84.5 76.4) (layer "In1.Cu"))
  (gr_text "3" (at 87.5 76.4) (layer "In2.Cu"))
  (gr_text "4" (at 90.5 76.4) (layer "B.Cu"))
  (gr_text "BOT" (at 85 69.5) (layer "B.Cu"))
  (zone (net 0) (net_name "") (layer "F.Cu") (hatch none 0.508)
    (connect_pads (clearance 0))
    (min_thickness 0.254) (filled_areas_thickness no)
    (keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed) (copperpour not_allowed) (footprints not_allowed))
    (fill (thermal_gap 0.508) (thermal_bridge_width 0.508) (island_removal_mode 2) (island_area_min 10))
    (polygon
      (pts
        (xy 83 77)
        (xy 80 77)
        (xy 80 74)
        (xy 83 74)
      )
    )
  )
  (zone (net 0) (net_name "") (layer "In1.Cu") (hatch none 0.508)
    (connect_pads (clearance 0))
    (min_thickness 0.254) (filled_areas_thickness no)
    (keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed) (copperpour not_allowed) (footprints not_allowed))
    (fill (thermal_gap 0.508) (thermal_bridge_width 0.508) (island_removal_mode 2) (island_area_min 10))
    (polygon
      (pts
        (xy 86 77)
        (xy 83 77)
        (xy 83 74)
        (xy 86 74)
      )
    )
  )
  (zone (net 0) (net_name "") (layer "In2.Cu") (hatch none 0.508)
    (connect_pads (clearance 0))
    (min_thickness 0.254) (filled_areas_thickness no)
    (keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed) (copperpour not_allowed) (footprints not_allowed))
    (fill (thermal_gap 0.508) (thermal_bridge_width 0.508) (island_removal_mode 2) (island_area_min 10))
    (polygon
      (pts
        (xy 89 77)
        (xy 86 77)
        (xy 86 74)
        (xy 89 74)
      )
    )
  )
  (zone (net 0) (net_name "") (layer "B.Cu") (hatch none 0.508)
    (connect_pads (clearance 0))
    (min_thickness 0.254) (filled_areas_thickness no)
    (keepout (tracks not_allowed) (vias not_allowed) (pads not_allowed) (copperpour not_allowed) (footprints not_allowed))
    (fill (thermal_gap 0.508) (thermal_bridge_width 0.508) (island_removal_mode 2) (island_area_min 10))
    (polygon
      (pts
        (xy 92 77)
        (xy 89 77)
        (xy 89 74)
        (xy 92 74)
      )
    )
  )
)
