(kicad_pcb (version 20210812) (generator pcbnew)
  (general
    (thickness 4.48)
  )
  (paper "A4")
  (title_block
    (title "Demo Project showing SameNetSpacing problem caused by KiCads filling algorithm")
    (date "2019-10-07")
    (rev "0.1")
  )
  (layers
    (0 "F.Cu" signal)
    (1 "In1.Cu" power)
    (2 "In2.Cu" power)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (color "Green") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.44) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "In1.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 2" (type "prepreg") (thickness 1.44) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "In2.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 3" (type "core") (thickness 1.44) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (color "Green") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0.05)
    (solder_mask_min_width 0.15)
    (aux_axis_origin 148.5 105)
    (pcbplotparams
      (layerselection 0x00010fc_ffffffff)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes false)
      (usegerberadvancedattributes false)
      (creategerberjobfile false)
      (svguseinch false)
      (svgprecision 6)
      (excludeedgelayer true)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "gerber/")
    )
  )
  (net 0 "")
  (net 1 "GND")
  (net 2 "VDD3V3")
  (gr_rect (start 136.2456 125.5776) (end 147.864 131.7576) (layer "Edge.Cuts") (width 0.01) (fill none))
  (zone (net 2) (net_name "VDD3V3") (layer "In2.Cu") (hatch none 0.508)
    (connect_pads (clearance 0.1524))
    (min_thickness 0.1524) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.1524) (thermal_bridge_width 1.27) (island_removal_mode 1) (island_area_min 0))
    (polygon
      (pts
        (xy 136.7048 126.6)
        (xy 136.7048 130.8)
        (xy 141.5 130.8)
        (xy 141.5 126.6)
      )
    )
  )
)
