(kicad_pcb
	(version 20240609)
	(generator "pcbnew")
	(generator_version "8.99")
	(general
		(thickness 1.6)
		(legacy_teardrops no)
	)
	(paper "A4")
	(layers
		(0 "F.Cu" signal)
		(1 "In1.Cu" signal)
		(2 "In2.Cu" signal)
		(3 "In3.Cu" signal)
		(4 "In4.Cu" signal)
		(31 "B.Cu" signal)
		(32 "B.Adhes" user "B.Adhesive")
		(33 "F.Adhes" user "F.Adhesive")
		(34 "B.Paste" user)
		(35 "F.Paste" user)
		(36 "B.SilkS" user "B.Silkscreen")
		(37 "F.SilkS" user "F.Silkscreen")
		(38 "B.Mask" user)
		(39 "F.Mask" user)
		(40 "Dwgs.User" user "User.Drawings")
		(41 "Cmts.User" user "User.Comments")
		(42 "Eco1.User" user "User.Eco1")
		(43 "Eco2.User" user "User.Eco2")
		(44 "Edge.Cuts" user)
		(45 "Margin" user)
		(46 "B.CrtYd" user "B.Courtyard")
		(47 "F.CrtYd" user "F.Courtyard")
		(48 "B.Fab" user)
		(49 "F.Fab" user)
		(50 "User.1" user)
		(51 "User.2" user)
		(52 "User.3" user)
		(53 "User.4" user)
		(54 "User.5" user)
		(55 "User.6" user)
		(56 "User.7" user)
		(57 "User.8" user)
		(58 "User.9" user)
	)
	(setup
		(stackup
			(layer "F.SilkS"
				(type "Top Silk Screen")
			)
			(layer "F.Paste"
				(type "Top Solder Paste")
			)
			(layer "F.Mask"
				(type "Top Solder Mask")
				(thickness 0.01)
			)
			(layer "F.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 1"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In1.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 2"
				(type "core")
				(thickness 0.535)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In2.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 3"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In3.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 4"
				(type "core")
				(thickness 0.535)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "In4.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "dielectric 5"
				(type "prepreg")
				(thickness 0.1)
				(material "FR4")
				(epsilon_r 4.5)
				(loss_tangent 0.02)
			)
			(layer "B.Cu"
				(type "copper")
				(thickness 0.035)
			)
			(layer "B.Mask"
				(type "Bottom Solder Mask")
				(thickness 0.01)
			)
			(layer "B.Paste"
				(type "Bottom Solder Paste")
			)
			(layer "B.SilkS"
				(type "Bottom Silk Screen")
			)
			(copper_finish "None")
			(dielectric_constraints no)
		)
		(pad_to_mask_clearance 0)
		(allow_soldermask_bridges_in_footprints no)
		(tenting front back)
		(pcbplotparams
			(layerselection 0x00010fc_ffffffff)
			(plot_on_all_layers_selection 0x0000000_00000000)
			(disableapertmacros no)
			(usegerberextensions no)
			(usegerberattributes yes)
			(usegerberadvancedattributes yes)
			(creategerberjobfile yes)
			(dashed_line_dash_ratio 12.000000)
			(dashed_line_gap_ratio 3.000000)
			(svgprecision 4)
			(plotframeref no)
			(mode 1)
			(useauxorigin no)
			(hpglpennumber 1)
			(hpglpenspeed 20)
			(hpglpendiameter 15.000000)
			(pdf_front_fp_property_popups yes)
			(pdf_back_fp_property_popups yes)
			(pdf_metadata yes)
			(dxfpolygonmode yes)
			(dxfimperialunits yes)
			(dxfusepcbnewfont yes)
			(psnegative no)
			(psa4output no)
			(plotreference yes)
			(plotvalue yes)
			(plotfptext yes)
			(plotinvisibletext no)
			(sketchpadsonfab no)
			(plotpadnumbers no)
			(subtractmaskfromsilk no)
			(outputformat 1)
			(mirror no)
			(drillshape 0)
			(scaleselection 1)
			(outputdirectory "")
		)
	)
	(net 0 "")
	(net 1 "A")
	(net 2 "B")
	(footprint "TestPoint:TestPoint_Pad_D2.0mm"
		(layer "F.Cu")
		(at 125 89)
		(descr "SMD pad as test Point, diameter 2.0mm")
		(tags "test point SMD pad")
		(property "Reference" "P2"
			(at 0 -1.998 0)
			(layer "F.SilkS")
		)
		(property "Value" "TestPoint_Pad_D2.0mm"
			(at 0 2.05 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Footprint" "TestPoint:TestPoint_Pad_D2.0mm"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(attr exclude_from_pos_files exclude_from_bom)
		(fp_text user "${REFERENCE}"
			(at 0 -2 0)
			(layer "F.Fab")
		)
		(pad "1" smd circle
			(at 0 0 90)
			(size 2 2)
			(layers "F.Cu" "F.Mask")
			(solder_mask_margin 0.45)
		)
	)
	(footprint "TestPoint:TestPoint_Pad_D2.0mm"
		(layer "F.Cu")
		(at 137 89)
		(descr "SMD pad as test Point, diameter 2.0mm")
		(tags "test point SMD pad")
		(property "Reference" "P5"
			(at 0 -1.998 0)
			(layer "F.SilkS")
		)
		(property "Value" "TestPoint_Pad_D2.0mm"
			(at 0 2.05 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Footprint" "TestPoint:TestPoint_Pad_D2.0mm"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(attr exclude_from_pos_files exclude_from_bom)
		(fp_text user "${REFERENCE}"
			(at 0 -2 0)
			(layer "F.Fab")
		)
		(pad "2" smd trapezoid
			(at 0 0 315)
			(size 3 2)
			(rect_delta 1 0)
			(layers "F.Cu")
		)
	)
	(footprint "TestPoint:TestPoint_Pad_D2.0mm"
		(layer "F.Cu")
		(at 133 89)
		(descr "SMD pad as test Point, diameter 2.0mm")
		(tags "test point SMD pad")
		(property "Reference" "P4"
			(at 0 -1.998 0)
			(layer "F.SilkS")
		)
		(property "Value" "TestPoint_Pad_D2.0mm"
			(at 0 2.05 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Footprint" "TestPoint:TestPoint_Pad_D2.0mm"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(attr exclude_from_pos_files exclude_from_bom)
		(fp_text user "${REFERENCE}"
			(at 0 -2 0)
			(layer "F.Fab")
		)
		(pad "Pad" smd roundrect
			(at 0 0 45)
			(size 3 2)
			(layers "F.Cu" "F.Adhes" "F.Paste" "F.Mask")
			(roundrect_rratio 0.1)
			(chamfer_ratio 0.21)
			(chamfer top_left bottom_right)
		)
	)
	(footprint "Jumper:SolderJumper-2_P1.3mm_Open_TrianglePad1.0x1.5mm"
		(layer "F.Cu")
		(at 121 93.6)
		(descr "SMD Solder Jumper, 1x1.5mm Triangular Pads, 0.3mm gap, open")
		(tags "solder jumper open")
		(property "Reference" "SB1"
			(at 0 -1.8 0)
			(layer "F.SilkS")
		)
		(property "Value" "SolderJumper-2_P1.3mm_Open_TrianglePad1.0x1.5mm"
			(at 0 1.9 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Footprint" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(layer "F.Fab")
			(hide yes)
		)
		(attr exclude_from_pos_files exclude_from_bom)
		(pad "1" smd custom
			(at -0.725 0)
			(size 0.3 0.3)
			(layers "F.Cu" "F.Mask")
			(zone_connect 2)
			(options
				(clearance outline)
				(anchor rect)
			)
			(primitives
				(gr_poly
					(pts
						(xy -0.5 -0.75) (xy 0.5 -0.75) (xy 1 0) (xy 0.5 0.75) (xy -0.5 0.75)
					)
					(width 0)
					(fill yes)
				)
			)
		)
		(pad "2" smd custom
			(at 0.725 0)
			(size 0.3 0.3)
			(layers "F.Cu" "F.Mask")
			(zone_connect 2)
			(options
				(clearance outline)
				(anchor rect)
			)
			(primitives
				(gr_poly
					(pts
						(xy -0.65 -0.75) (xy 0.5 -0.75) (xy 0.5 0.75) (xy -0.65 0.75) (xy -0.15 0)
					)
					(width 0)
					(fill yes)
				)
			)
		)
	)
	(footprint "TestPoint:TestPoint_Pad_D2.0mm"
		(layer "F.Cu")
		(at 121 89)
		(descr "SMD pad as test Point, diameter 2.0mm")
		(tags "test point SMD pad")
		(property "Reference" "P1"
			(at 0 -1.998 0)
			(layer "F.SilkS")
		)
		(property "Value" "TestPoint_Pad_D2.0mm"
			(at 0 2.05 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Footprint" "TestPoint:TestPoint_Pad_D2.0mm"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(attr exclude_from_pos_files exclude_from_bom)
		(fp_text user "${REFERENCE}"
			(at 0 -2 0)
			(layer "F.Fab")
		)
		(pad "1" smd circle
			(at 0 0)
			(size 2 2)
			(layers "F.Cu" "F.Mask")
			(solder_paste_margin_ratio -0.1)
		)
	)
	(footprint "TestPoint:TestPoint_Pad_D2.0mm"
		(layer "F.Cu")
		(at 129.6 97.05)
		(descr "SMD pad as test Point, diameter 2.0mm")
		(tags "test point SMD pad")
		(property "Reference" "P6"
			(at 0 -1.998 0)
			(layer "F.SilkS")
		)
		(property "Value" "TestPoint_Pad_D2.0mm"
			(at 0 2.05 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Footprint" "TestPoint:TestPoint_Pad_D2.0mm"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(attr exclude_from_pos_files exclude_from_bom)
		(fp_text user "${REFERENCE}"
			(at 0 -2 0)
			(layer "F.Fab")
		)
		(pad "1" smd custom
			(at 0 0 90)
			(size 2 2)
			(layers "F.Cu" "F.Mask")
			(thermal_bridge_angle 90)
			(options
				(clearance outline)
				(anchor circle)
			)
			(primitives
				(gr_bbox
					(start -5.08 -4.1275)
					(end -3.175 -0.9525)
					(fill no)
				)
				(gr_poly
					(pts
						(xy -2.54 -2.54) (xy 0 -2.54) (xy 0 0) (xy -5.08 0) (xy -5.08 -5.08) (xy -2.54 -5.08)
					)
					(width 0.2)
					(fill yes)
				)
				(gr_arc
					(start 3.54 -2.54)
					(mid 2.796051 -0.743949)
					(end 1 0)
					(width 0.25)
				)
				(gr_circle
					(center 3.54 -3.54)
					(end 3.54 -2.54)
					(width 0.1)
					(fill yes)
				)
				(gr_line
					(start 0 0.635)
					(end 1.905 3.81)
					(width 0.2)
				)
				(gr_rect
					(start 1.905 3.81)
					(end 3.175 5.08)
					(width 0)
					(fill yes)
				)
			)
		)
	)
	(footprint "TestPoint:TestPoint_Pad_D2.0mm"
		(layer "F.Cu")
		(at 129 89)
		(descr "SMD pad as test Point, diameter 2.0mm")
		(tags "test point SMD pad")
		(property "Reference" "P3"
			(at 0 -1.998 0)
			(layer "F.SilkS")
		)
		(property "Value" "TestPoint_Pad_D2.0mm"
			(at 0 2.05 0)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Footprint" "TestPoint:TestPoint_Pad_D2.0mm"
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Datasheet" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(property "Description" ""
			(at 0 0 0)
			(unlocked yes)
			(layer "F.Fab")
			(hide yes)
		)
		(attr exclude_from_pos_files exclude_from_bom)
		(fp_text user "${REFERENCE}"
			(at 0 -2 0)
			(layer "F.Fab")
		)
		(pad "Pad" smd circle
			(at 0 0 90)
			(size 2 2)
			(property pad_prop_bga)
			(layers "F.Cu" "F.Paste" "F.Mask")
			(die_length 1.8)
			(clearance 1)
		)
	)
	(gr_rect
		(start 118 78)
		(end 146 106)
		(fill none)
		(layer "Edge.Cuts")
	)
)
