(kicad_pcb (version 20210722) (generator pcbnew)
  (general
    (thickness 1.6)
  )
  (paper "A4")
  (title_block
    (date "jeu. 02 avril 2015")
  )
  (layers
    (0 "F.Cu" signal)
    (31 "B.Cu" signal)
    (32 "B.Adhes" user "B.Adhesive")
    (33 "F.Adhes" user "F.Adhesive")
    (34 "B.Paste" user)
    (35 "F.Paste" user)
    (36 "B.SilkS" user "B.Silkscreen")
    (37 "F.SilkS" user "F.Silkscreen")
    (38 "B.Mask" user)
    (39 "F.Mask" user)
    (40 "Dwgs.User" user "User.Drawings")
    (41 "Cmts.User" user "User.Comments")
    (42 "Eco1.User" user "User.Eco1")
    (43 "Eco2.User" user "User.Eco2")
    (44 "Edge.Cuts" user)
    (45 "Margin" user)
    (46 "B.CrtYd" user "B.Courtyard")
    (47 "F.CrtYd" user "F.Courtyard")
    (48 "B.Fab" user)
    (49 "F.Fab" user)
  )
  (setup
    (stackup
      (layer "F.SilkS" (type "Top Silk Screen"))
      (layer "F.Paste" (type "Top Solder Paste"))
      (layer "F.Mask" (type "Top Solder Mask") (color "Green") (thickness 0.01))
      (layer "F.Cu" (type "copper") (thickness 0.035))
      (layer "dielectric 1" (type "core") (thickness 1.51) (material "FR4") (epsilon_r 4.5) (loss_tangent 0.02)
        addsublayer (thickness 0))
      (layer "B.Cu" (type "copper") (thickness 0.035))
      (layer "B.Mask" (type "Bottom Solder Mask") (color "Green") (thickness 0.01))
      (layer "B.Paste" (type "Bottom Solder Paste"))
      (layer "B.SilkS" (type "Bottom Silk Screen"))
      (copper_finish "None")
      (dielectric_constraints no)
    )
    (pad_to_mask_clearance 0)
    (solder_mask_min_width 1)
    (aux_axis_origin 138.176 110.617)
    (pcbplotparams
      (layerselection 0x0000000_7fffffff)
      (disableapertmacros false)
      (usegerberextensions false)
      (usegerberattributes true)
      (usegerberadvancedattributes true)
      (creategerberjobfile true)
      (svguseinch false)
      (svgprecision 6)
      (excludeedgelayer true)
      (plotframeref false)
      (viasonmask false)
      (mode 1)
      (useauxorigin false)
      (hpglpennumber 1)
      (hpglpenspeed 20)
      (hpglpendiameter 15.000000)
      (dxfpolygonmode true)
      (dxfimperialunits true)
      (dxfusepcbnewfont true)
      (psnegative false)
      (psa4output false)
      (plotreference true)
      (plotvalue true)
      (plotinvisibletext false)
      (sketchpadsonfab false)
      (subtractmaskfromsilk false)
      (outputformat 1)
      (mirror false)
      (drillshape 0)
      (scaleselection 1)
      (outputdirectory "")
    )
  )
  (net 0 "")
  (net 1 "GND")
  (net 2 "signal")
  (footprint "Housings_DIP:DIP-14_W7.62mm_LongPads" (layer "F.Cu")
    (tedit 6103325A)
    (at 145.875 45)
    (descr "14-lead dip package, row spacing 7.62 mm (300 mils), longer pads")
    (tags "dil dip 2.54 300")
    (attr through_hole)
    (fp_text reference "REF**" (at 0 -5.22) (layer "F.SilkS"))
    (fp_text value "DIP-14_W7.62mm_LongPads" (at 0 -3.72) (layer "F.Fab"))
    (pad "1" thru_hole roundrect locked (at 0 0) (size 2.3 1.6) (drill 0.8) (layers *.Cu *.Mask) (roundrect_rratio 0.25))
    (pad "2" thru_hole roundrect locked (at 0 2.54) (size 2.3 1.6) (drill 0.8) (layers *.Cu *.Mask) (roundrect_rratio 0.25))
    (pad "3" thru_hole roundrect locked (at 0 5.08) (size 2.3 1.6) (drill 0.8) (layers *.Cu *.Mask) (roundrect_rratio 0)
      (chamfer_ratio 0.2) (chamfer top_left top_right bottom_left bottom_right))
    (pad "4" thru_hole roundrect locked (at 0 7.62) (size 2.3 1.6) (drill 0.8) (layers *.Cu *.Mask) (roundrect_rratio 0)
      (chamfer_ratio 0.2) (chamfer top_left top_right bottom_left bottom_right))
    (pad "5" thru_hole oval locked (at 0 10.16) (size 2.3 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad "6" thru_hole oval locked (at 0 12.7) (size 2.3 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad "7" thru_hole oval locked (at 0 15.24) (size 2.3 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 2 "signal"))
    (pad "8" thru_hole oval locked (at 7.62 15.24) (size 2.3 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 1 "GND"))
    (pad "9" thru_hole oval locked (at 7.62 12.7) (size 2.3 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 1 "GND"))
    (pad "10" thru_hole oval locked (at 7.62 10.16) (size 2.3 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad "11" thru_hole oval locked (at 7.62 7.62) (size 2.3 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 1 "GND") (thermal_gap 0.45))
    (pad "12" thru_hole oval locked (at 7.62 5.08) (size 2.3 1.6) (drill 0.8) (layers *.Cu *.Mask)
      (net 1 "GND") (thermal_gap 0.45))
    (pad "13" thru_hole oval locked (at 7.62 2.54) (size 2.3 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (pad "14" thru_hole oval locked (at 7.62 0) (size 2.3 1.6) (drill 0.8) (layers *.Cu *.Mask))
    (model "Housings_DIP.3dshapes/DIP-14_W7.62mm_LongPads.wrl"
      (offset (xyz 0 0 0))
      (scale (xyz 1 1 1))
      (rotate (xyz 0 0 0))
    )
  )
  (gr_text "clearance error" (at 138.43 57.785) (layer "F.SilkS"))
  (gr_text "clearance error" (at 138.43 47.625) (layer "F.SilkS"))
  (gr_text "0.45mm local override thermal gap" (at 168.275 51.435) (layer "F.SilkS"))
  (gr_text "0.4mm thermal gap" (at 162.56 59.055) (layer "F.SilkS"))
  (gr_text "clearance error" (at 138.43 52.705) (layer "F.SilkS"))
  (zone (net 1) (net_name "GND") (layer "F.Cu") (hatch edge 0.508)
    (connect_pads (clearance 0.1254))
    (min_thickness 0.1254) (filled_areas_thickness no)
    (fill yes (thermal_gap 0.4) (thermal_bridge_width 0.8))
    (polygon
      (pts
        (xy 162.56 71.12)
        (xy 137.16 71.12)
        (xy 137.16 35.56)
        (xy 162.56 35.56)
      )
    )
  )
)
